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IC Technology Presentation Transcript
1.IC Technology
2.My Introduction I have done R & D in IC Technology from 1963 to 2003 – 40 years experience I am First in India to fabricate Bipolar junction transistors using IC Technology Bipolar Monolithic ICs using IC Technology ‘Space Qualified’ Hybrid Microcircuits that were flown in satellites by ISRO
3.My Work Patents: 8 Papers: 65 Technical Reports: 26 All these are in the area of IC Technology
4.Patents "Improvements In Or Relating To An Apparatus For Diffusion Of Impurities In Semiconductors Using Liquid Dopants" Sealed, No.2291/CAL/73 (1973). "A Novel Electrolytic Cell For Anodic Oxidation Of Conductors/Semiconductors" Sealed, No 2552/Cal/74 (1974). “A Process For Formation Of Stencil For Solder Cream Printing On Thick Film Hybrid Circuits”: Sealed (No. 633. Dec./87), 1987 “A Process For The Manufacture Of Electronic Device Such As Hybrid Microcircuits, Printed Circuit Boards And Passive Components” No. 2132/DEL /97 (1997).
5.Patents "A Process For Joining Metal-To-Thick-Film Composite System On Insulating Substrate,“ No. 3347/DEL/97 (1997) A Process For The Fabrication Of Improved Metallised Ceramic Substrate Useful For Assembly Of Semiconductor Devices“ No. NF 406/99 (1999) "A Novel Metallic Paste Composition Useful As An Interlayer In Diffusion Soldering", No. NF/210/99 (2002) "A Process For Diffusion Soldering", No. NF/160/2002 (2002)
6.What is IC Technology? It is the simplest and easiest paper of VII sem Practically no maths No big theory to mug Easy to remember processes
7.IC Technology It is concerned with large scale manufacturing of electronic systems The systems are integrated in a monolithic piece of semiconductor material.
8.What Does It Include? Basic Processes Process Integration 9.What have you read? Formation of p-n junctions Crystal Structure pcb design and fabrication Bipolar junction transistors n- MOS, p – MOS and CMOS transistors Monolithic IC Hybrid IC 10.VLSI: Very Large Scale Integrated Circuit The term DESIGN encompasses determination of: Materials and their specifications Physical dimensions of each device Paths for interconnecting these devices in the desired manner It may also include physical structure and materials of various layers of the devices
11.Requirement of raw materials Silicon: specifications Optically flat substrate - disk type Thickness = 1 – 2 + 0.005 mm Diameter = 300 + 0.5 mm Free from defects Resistivity – as per design Type – n, n+, p, p+ - as per design Orientation – (111), (100) – as per design
12.What do we require for fabricating such a structure? n-type, p-type and again n-type semiconductors of desired physical size and electrical properties. These should be in intimate contact forming p-n junctions. Electrical contacts with these regions Electrical connection to these regions from other devices, pins etc. Isolation between various devices.
13.How do we do it? How do we change n type in p type and vice versa?
14.Diffusion
15.Ion Implantation
16.How do we connect the devices? Interconnection
17.How do we isolate the devices? Isolation Purpose: To isolate different devices that are being fabricated on the same chip.
18.What should we study for this? Introduction to technologies (UNIT 1) Diffusion and Ion Implantation (UNIT 2) Chemical Vapor Deposition and Layer Growth (UNIT 3) Pattern Transfer (UNIT 4) VLSI Process Integration (UNIT 5)
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